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TGP 40000SF-0.020-00-0406

Name: Bergquist Company TGP 40000SF-0.020-00-0406
Brand: Bergquist Company
SKU: 951-TGP400SF.0200046
Price: 2410.53 TWD
Availability: InStock

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Mouser 編號：

951-TGP400SF.0200046

製造商編號：

TGP 40000SF-0.020-00-0406

製造商：

Bergquist Company

說明：

熱介面產品 GAP PAD, Sil-Free, 40W/m-K, 4x6" Sheet, 0.020" Thickness, Thermexit, IDH 2972783

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規格書:

TGP 40000SF-0.020-00-0406 規格書 (PDF)

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庫存量: 176

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工廠前置作業時間：: 5 週工廠預計生產時間數量大於所顯示的數量。

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最少： 1 多個： 1

單價:

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總價:

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Pricing (TWD)

數量	單價	總價
	NT$2,410.53	NT$2,410.53
	NT$2,268.43	NT$22,684.30
	NT$2,127.12	NT$53,178.00
	NT$1,985.03	NT$99,251.50
	NT$1,914.17	NT$191,417.00

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商品屬性	屬性值	選擇屬性
製造商:	Bergquist Company
產品類型:	熱介面產品
RoHS:
產品:	Gap Fillers / Gap Pads / Sheets
類型:	Thermal Pad
封裝/外殼:	Non-standard
材料:	Silicone-Free Polymer
熱導率:	40 W/m-K
色彩:	Black
最低工作溫度:	- 40 C
最高工作溫度:	+ 150 C
長度:	152.4 mm
寬度:	101.6 mm
厚度:	0.508 mm
系列:	TGP 40000SF
品牌:	Bergquist Company
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
設計目的:	Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
產品類型:	Thermal Interface Products
大小:	4 in x 6 in
原廠包裝數量:	1000
子類別:	Thermal Management
公司名稱:	GAP PAD / Thermexit
零件號別名:	TGP 40000SF-0.020-00-0406-NA 2972783
每件重量:	12 g

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所選屬性: 0

篩選文檔:

規格書

TGP 40000SF-0.020-00-0406 規格書 (PDF)

Application Notes

Application Note: Handling and Converting Guide - Berqquist GAP PAD TGP 40000SF 6 Inch Sheets (PDF)

Images

MSDS

Safety Data Sheet (PDF)

Product Catalogs

Technical Resources

Product Presentation (PDF)

CAHTS:: 3920990000
USHTS:: 3920995000
ECCN:: EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.