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TGP40000SF-0.020-01-0406-NA

Name: Bergquist Company TGP40000SF-0.020-01-0406-NA
Brand: Bergquist Company
SKU: 951-TGP400SF.0200146
Price: 2651.42 TWD
Availability: InStock

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Mouser 編號：

951-TGP400SF.0200146

製造商編號：

TGP40000SF-0.020-01-0406-NA

製造商：

Bergquist Company

說明：

熱介面產品 GAP PAD, Sil-Free, 40W/m-K, 4 x 6" Sheet, Tacky Pad, 0.020" Thickness, Thermexit

壽命週期:

新產品:

該製造商的新產品。

規格書:

TGP40000SF-0.020-01-0406-NA 規格書 (PDF)

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庫存量: 49

庫存：: 49

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在途量:: 60
工廠前置作業時間：: 6

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

此產品免費航運

Pricing (TWD)

數量	單價	總價
	NT$2,651.42	NT$2,651.42
	NT$2,495.55	NT$24,955.50
	NT$2,339.68	NT$46,793.60
	NT$2,183.41	NT$131,004.60
	NT$2,105.47	NT$210,547.00

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商品屬性	屬性值	選擇屬性
製造商:	Bergquist Company
產品類型:	熱介面產品
RoHS:
產品:	Gap Fillers / Gap Pads / Sheets
類型:	Thermal Pad
封裝/外殼:	Non-standard
材料:	Silicone-Free Polymer
熱導率:	40 W/m-K
色彩:	Black
最低工作溫度:	- 40 C
最高工作溫度:	+ 150 C
長度:	152.4 mm
寬度:	101.6 mm
厚度:	0.508 mm
系列:	TGP 40000SF
品牌:	Bergquist Company
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
設計目的:	Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
高度:	4 in
產品類型:	Thermal Interface Products
大小:	4 in x 6 in
原廠包裝數量:	20
子類別:	Thermal Management
公司名稱:	GAP PAD / Thermexit
零件號別名:	TGP40000SF-0.020-01-0406 2988063
每件重量:	20 g

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篩選文檔:

規格書

TGP40000SF-0.020-01-0406-NA 規格書 (PDF)

Images

MSDS

Safety Data Sheet (PDF)

Product Catalogs

Technical Resources

Product Presentation (PDF)

USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.