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HDTM-3-06-2-S-VT-0-3

Name: Samtec HDTM-3-06-2-S-VT-0-3
Brand: Samtec
SKU: 200-HDTM-3062SVT03
Price: 353.52 TWD
Availability: OutOfStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-HDTM-3062SVT03

製造商編號：

HDTM-3-06-2-S-VT-0-3

製造商：

Samtec

說明：

高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

規格書:

HDTM-3-06-2-S-VT-0-3 規格書 (PDF)

ECAD模型:

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庫存：: 暫無庫存

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工廠前置作業時間：: 3 週工廠預計生產時間。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

Pricing (TWD)

數量	單價	總價
	NT$353.52	NT$353.52
	NT$306.72	NT$7,668.00
	NT$259.20	NT$12,960.00
	NT$171.00	NT$92,169.00
	NT$159.48	NT$159,639.48
	NT$142.56	NT$362,244.96
5,005	報價

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商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	高速/模組連接器
RoHS:
產品:	Headers
排數:	6 Row
間距:	1.8 mm
終端類型:	Solder Pin
觸點电镀:	Gold
系列:	HDTM
封裝:	Tray
品牌:	Samtec
觸點材料:	Copper Alloy
組裝國家:	Not Available
擴散國:	Not Available
原產國:	CN
外殼顏色:	Black
外殼材料:	Liquid Crystal Polymer (LCP)
最高工作溫度:	+ 105 C
最低工作溫度:	- 40 C
裝配角:	Vertical
產品類型:	High Speed / Modular Connectors
原廠包裝數量:	77
子類別:	Backplane Connectors
公司名稱:	XCede

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所選屬性: 0

篩選文檔:

規格書

HDTM-3-06-2-S-VT-0-3 規格書 (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.