170673-2278

Name: Molex 170673-2278
Brand: Molex
SKU: 538-170673-2278
Price: 1868.76 TWD
Availability: InStock

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Mouser 編號：

538-170673-2278

製造商編號：

170673-2278

製造商：

Molex

說明：

標準卡緣連接器 EDGELINE 278CKTS 0.062 PCB

規格書:

170673-2278 規格書

ECAD模型:

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庫存量: 198

庫存：: 198 可立即送貨

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輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

此產品免費航運

Pricing (TWD)

數量	單價	總價
	NT$1,868.76	NT$1,868.76
	NT$1,588.68	NT$15,886.80
	NT$1,489.32	NT$37,233.00
	NT$1,418.04	NT$70,902.00
	NT$1,279.44	NT$127,944.00
	NT$1,266.12	NT$364,642.56

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商品屬性	屬性值	選擇屬性
製造商:	Molex
產品類型:	標準卡緣連接器
RoHS:
定位數:	278 Position
間距:	0.8 mm
安裝風格:	Press Fit
裝配角:	Vertical
觸點电镀:	Gold
系列:	170673
品牌:	Molex
觸點材料:	Tin
組裝國家:	Not Available
擴散國:	Not Available
原產國:	CN
额定电流:	1.5 A
外殼材料:	Thermoplastic (TP)
最高工作溫度:	+ 105 C
最低工作溫度:	- 40 C
封裝:	Tray
產品類型:	Standard Card Edge Connectors
原廠包裝數量:	1
子類別:	Card Edge Connectors
公司名稱:	EdgeLine
額定電壓:	250 VAC
零件號別名:	1706732278 1706732278
每件重量:	11.073 g

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所選屬性: 0

篩選文檔:

規格書

170673-2278 規格書

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

EdgeLine Connectors

Molex EdgeLine Low-Profile Connectors support up to 25Gbps data rates and are available in multiple orientations and PCB thicknesses from 1.57mm to 3.18mm for use in high-speed transmissions and high-density signal applications. The product line's one-piece solutions are cost-effective as they are only required when a peripheral interface or upgrade card is populated. EdgeLine includes a customizable card-edge interface to enable designers to specify first-mate, last-break designations as well as shorter stubs for high-speed communications. The Molex EdgeLine family delivers a low-cost, flexible, and scalable solution for low-to-mid range telecom, computing, and storage applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.