CP502550665-2

多級Peltier模組

CUI多級Peltier模組包含兩個用機械方式堆疊的模組，熱泵能力更為出色。多級Peltier模組具有更高的溫差、可靠的固態結構，還有精準的溫度控制。這些熱電散熱 (TEC) 裝置非常適合無法使用強制氣流散熱的高密度、高功率應用，以及冷藏和密封式環境。CUI有多款高效能的多級Peltier模組均採用arcTEC™結構，可提供更長的熱循環壽命，改善散熱效能。

arcTEC Structure High-Performance Peltier Modules

Same Sky High-Performance Peltier Modules with arcTEC™ Structure feature a unique construction that delivers superior cooling performance and longer cycle life. The innovative arcTEC structure combats the effects of thermal fatigue found in thermoelectric modules. The structure incorporates a thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module, high-temperature solder, and larger P/N elements made from a premium silicon ingot. The combination of these three enhancements greatly improves the reliability, performance, and cycle life of Peltier modules built with the arcTEC structure, allowing thedevices to outperform conventional thermoelectric coolers in the most demanding applications.

Peltier Thermoelectric Cooling Devices

CUI Peltier thermoelectric cooling (TEC) devices fulfill the thermal management needs of a variety of applications. Ideal for designs where size and weight are limited, these Peltier devices range in size from 10mm to 70mm with profiles as low as 3mm. CUI Peltier TEC devices also have no moving parts, virtually eliminating the need for maintenance. Several high performance Peltier modules built with the arcTEC™ structure are also available, offering improved reliability, performance, and cycle life.