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DD180N16SHPSA1

Name: Infineon DD180N16SHPSA1
Brand: Infineon Technologies
SKU: 726-DD180N16SHPSA1
Price: 1755.36 TWD
Availability: InStock

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Mouser 編號：

726-DD180N16SHPSA1

製造商編號：

DD180N16SHPSA1

製造商：

Infineon Technologies

說明：

二極管模組 L#T-BOND MODULE

規格書:

DD180N16SHPSA1 規格書 (PDF)

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庫存量: 16

庫存：: 16

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在途量:: 32
工廠前置作業時間：: 4

週工廠預計生產時間數量大於所顯示的數量。

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最少： 1 多個： 1

單價:

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總價:

NT$-.--

估計關稅:

此產品免費航運

Pricing (TWD)

數量	單價	總價
	NT$1,755.36	NT$1,755.36
	NT$1,264.32	NT$10,114.56
	NT$1,244.88	NT$129,467.52

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Infineon
產品類型:	二極管模組
RoHS:
安裝風格:	Screw Mount
封裝/外殼:	PB34
Vr - 反向電壓:	1.6 kV
Vf - 順向電壓:	1.39 V
最低工作溫度:	- 40 C
最高工作溫度:	+ 135 C
封裝:	Tray
品牌:	Infineon Technologies
組裝國家:	Not Available
擴散國:	Not Available
原產國:	DE
產品類型:	Diode Modules
原廠包裝數量:	8
子類別:	Discrete and Power Modules
技術:	Si
零件號別名:	DD180N16S SP001495438
每件重量:	165 g

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篩選文檔:

規格書

DD180N16SHPSA1 規格書 (PDF)

Application Notes

Product Catalogs

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CNHTS:: 8504409190
USHTS:: 8541100080
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.