SM9235-BCE-S-300-000

TE Connectivity / SMI
987-SM9235BCES300000
SM9235-BCE-S-300-000

製造商：

說明：
板機接口壓力傳感器 300PA DIFF. DIGITAL PRESSURE SENSOR

規格書:
ECAD模型:
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庫存量: 3

庫存：
3 可立即送貨
工廠前置作業時間：
11 週 工廠預計生產時間數量大於所顯示的數量。
數量超過3會受到最小訂單要求的限制。
最少： 1   多個： 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$1,560.24 NT$1,560.24
NT$1,433.52 NT$7,167.60
NT$1,386.36 NT$13,863.60
NT$1,330.56 NT$33,264.00
NT$1,258.92 NT$62,946.00
NT$1,222.56 NT$122,256.00
NT$1,205.28 NT$301,320.00
500 報價

商品屬性 屬性值 選擇屬性
TE Connectivity
產品類型: 板機接口壓力傳感器
RoHS:  
Gauge
0 Pa to 300 Pa
2.5 %
Digital
SMD/SMT
I2C
3.3 V
Dual Radial Barbed
16 bit
SOIC-16
- 20 C
+ 85 C
SM923X
Tube
品牌: TE Connectivity / SMI
組裝國家: Not Available
擴散國: Not Available
原產國: US
濕度敏感: Yes
運作供電電流: 3.3 mA
端口尺寸: 3 mm
產品類型: Board Mount Pressure Sensors
原廠包裝數量: 1
子類別: Sensors
電源電壓 - 最大值: 5.5 V
電源電壓 - 最小值: 3 V
零件號別名: 9235-BCE-S-300-000
每件重量: 8.233 g
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所選屬性: 0

規格書

CNHTS:
8542391000
USHTS:
9026208000
TARIC:
9026208090
ECCN:
EAR99

SM9x Uncompensated Low-Pressure Sensors

TE Connectivity / SMI SM9x Uncompensated Low-Pressure Sensors are available in SO-16 SMT small out-line package. These low-pressure sensors incorporate pressure die to achieve high performance in full-scale pressure ranges of 0.15, 0.6, and 1.5PSI. The SM9x uncompensated pressure sensors are available in Gauge (G) and Differential (D) pressure options. Applications include handheld meters, wound therapy, health monitoring, pressure switches, and sports equipment.

SM923x Series Ultra-Low Gauge Pressure Sensors

TE Connectivity / SMI SM923x Series Ultra-Low Gauge Pressure Sensors offer state-of-the-art MEMS pressure transducer technology and CMOS mixed signal processing technology. SMI SM923x Sensors produce a digital, fully conditioned, multi-order pressure and temperature-compensated sensor in JEDEC standard SOIC-16 package with a dual vertical porting option. The total accuracy after board mount and system level autozero is less than 1%FS. Combining the pressure sensor with a signal-conditioning ASIC in a single package simplifies the use of advanced silicon micro-machined pressure sensors. The pressure sensor can be mounted directly on a standard printed circuit board, and a high-level, calibrated pressure signal can be acquired from the digital interface. This eliminates the need for additional circuitry, such as a compensation network or microcontroller containing a custom correction algorithm.

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