TT190N16SOFHPSA2

Infineon Technologies
726-TT190N16SOFHPSA2
TT190N16SOFHPSA2

製造商：

說明：
單晶閘管模組 L#T-BOND MODULE

規格書:
ECAD模型:
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庫存量: 99

庫存：
99
可立即送貨
在途量:
72
工廠前置作業時間：
24
週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$1,878.12 NT$1,878.12
NT$1,575.72 NT$12,605.76

商品屬性 屬性值 選擇屬性
Infineon
產品類型: 單晶閘管模組
RoHS:  
145 mA
- 40 C
+ 125 C
Screw Mount
PB34
Tray
品牌: Infineon Technologies
組裝國家: Not Available
擴散國: Not Available
原產國: DE
保持電流 Ih 最大: 400 mA
產品類型: Thyristor Modules
原廠包裝數量: 8
子類別: Discrete and Power Modules
技術: Si
類型: Thyristor
零件號別名: TT190N16SOF SP001206302
每件重量: 165 g
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所選屬性: 0

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CNHTS:
8504409100
CAHTS:
8541300000
USHTS:
8541300080
JPHTS:
854130000
TARIC:
8541300000
ECCN:
EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.

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