CPU和晶片散熱器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

電腦模組 - COM COM HPC Size A module with Intel Core i7-1185GRE Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

電腦模組 - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

電腦模組 - COM COM HPC Size A module with Intel Core i5-1145G7E Processor, quad core with 2.6GHz (up to 4.1GHz), 8MB L2 cache, GT80 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

電腦模組 - COM COM HPC Size A module with Intel Celeron 6305E Processor, dual core with 1.8GHz, 4MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (15W TDP).

CPU和晶片散熱器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU和晶片散熱器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.