|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-1-K-TR
- Samtec
-
300:
NT$531.00
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM30015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$531.00
|
|
|
NT$454.32
|
|
|
NT$389.52
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-2-K-TR
- Samtec
-
300:
NT$531.00
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30015L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$531.00
|
|
|
NT$454.32
|
|
|
NT$389.52
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-04-2-K-TR
- Samtec
-
450:
NT$367.56
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM30015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
|
NT$367.56
|
|
|
NT$314.28
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-06-2-K-TR
- Samtec
-
300:
NT$437.04
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
|
NT$437.04
|
|
|
NT$374.04
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-1-K-TR
- Samtec
-
300:
NT$557.64
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30015S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$557.64
|
|
|
NT$477.00
|
|
|
NT$408.96
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-2-K-TR
- Samtec
-
300:
NT$557.64
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$557.64
|
|
|
NT$477.00
|
|
|
NT$408.96
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-40-01.0-L-04-2-K-TR
- Samtec
-
475:
NT$437.04
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM40010L042KTR
|
Samtec
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
|
|
無庫存前置作業時間 10 週
|
|
|
NT$437.04
|
|
|
NT$374.04
|
|
|
報價
|
|
|
報價
|
|
最少: 475
倍數: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-1-K-TR
- Samtec
-
325:
NT$519.84
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$519.84
|
|
|
NT$444.96
|
|
|
NT$381.24
|
|
最少: 325
倍數: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-1-K-TR
- Samtec
-
300:
NT$663.12
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM40010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$663.12
|
|
|
NT$567.36
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-06-2-K-TR
- Samtec
-
325:
NT$546.84
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$546.84
|
|
|
NT$468.00
|
|
|
NT$401.04
|
|
最少: 325
倍數: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$697.68
-
無庫存前置作業時間 8 週
|
Mouser 元件編號
200-LPAM40010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 8 週
|
|
|
NT$697.68
|
|
|
NT$596.88
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
NT$446.40
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$446.40
|
|
|
NT$381.96
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
NT$446.40
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40015L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$446.40
|
|
|
NT$381.96
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
NT$677.16
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM40015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
|
NT$677.16
|
|
|
NT$579.60
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
NT$468.72
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM40015S041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
|
NT$468.72
|
|
|
NT$343.80
|
|
最少: 450
倍數: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
NT$468.72
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM40015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
|
NT$468.72
|
|
|
NT$401.04
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$832.32
-
無庫存前置作業時間 8 週
|
Mouser 元件編號
200-LPAM50010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 8 週
|
|
|
NT$832.32
|
|
|
NT$610.56
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$832.32
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM50010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$832.32
|
|
|
NT$610.56
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
NT$945.36
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM50015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$945.36
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
NT$507.60
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM10010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
|
NT$507.60
|
|
|
NT$485.64
|
|
|
NT$467.28
|
|
|
NT$433.08
|
|
|
NT$316.44
|
|
|
檢視
|
|
|
NT$371.88
|
|
|
NT$316.44
|
|
|
NT$270.72
|
|
|
報價
|
|
最少: 1
倍數: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
300:
NT$437.04
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM20010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
|
NT$437.04
|
|
|
NT$374.04
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$459.72
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM20010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
|
NT$459.72
|
|
|
NT$393.48
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-1-K-TR
- Samtec
-
300:
NT$437.04
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM2001.0L081K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$437.04
|
|
|
NT$374.04
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
:
300
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-1-K-TR
- Samtec
-
1:
NT$737.64
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM2001.0S081K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$737.64
|
|
|
NT$705.24
|
|
|
NT$678.60
|
|
|
NT$628.92
|
|
|
NT$459.72
|
|
|
檢視
|
|
|
NT$540.36
|
|
|
NT$393.48
|
|
|
報價
|
|
最少: 1
倍數: 1
:
300
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|