嵌入式解決方案

記憶體模組 DDR4-2400, 8GB, 1024Mx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(512M x8*16 ) height:30mm

介面模組 PC/104 MVB Interface Module Device

電腦模組 - COM JUMPtec COMe-cKL6 i5-7300U 4GB

DRAM 128M, 1.8V, Mobile DDR, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R

電腦模組 - COM COM-HPC Size D module based on Intel Xeon D1715TER 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2400 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range.

電腦模組 - COM COM-HPC Size D module based on Intel Xeon D1732TE 8-core processor with tbd GHz, 15MB cache and dual channel DDR4 2400 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range.

加速感測器模組 4810A-002-D

電腦模組 - COM JUMPtec HSP COMe-cAL6 E2 thread

視頻 IC 開發工具 GT1724 Evaluation Board

電腦模組 - COM

電腦模組 - COM COM Express Type 6 Basic module based on Intel Celeron Processor G4932E 2-core processor with 1.9GHz, 2MB Intel Smart Cache, Intel UHD Graphics 610 and dual channel DDR4 2400 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370.

電腦模組 - COM COM Express Type 6 Basic module based on Intel Celeron Processor G4930E 2-core processor with 2.4GHz, 2MB Intel Smart Cache, Intel UHD Graphics 610 and dual channel DDR4 2400 MT/s memory interface (formerly Coffee Lake-H Refresh). Chipset HM370.