Renesas / Dialog 射頻與無線裝置

藍芽模組-802.15.1 Bluetooth Low Energy 5.2 Module with integrated ARM Cortex M33, memories and peripherals

藍芽開發工具-802.15.1 Daughterboard for DA14683DEVKT-P Pro

藍芽開發工具-802.15.1 Connectivity Production Line Tool companion board for debugging

藍芽開發工具-802.15.1 Connectivity Production Line Tool Kit for Bluetooth LE devices

RF系統單晶片 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch package

RF系統單晶片 - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitch

RF系統單晶片 - SoC Bluetooth Low Energy 5.0 SoC with integrated ARM Cortex M0, PMU, memories, voice interface and peripherals, 105degC ? 25 GPIOsin QFN40 and 0.4mm pin pitch package

RF系統單晶片 - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package

藍芽開發工具-802.15.1 Bluetooth Low Energy DA14531 WL-CSP daughterboard for the DA14531DEVKT-P Pro motherboard

RF系統單晶片 - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

RF系統單晶片 - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols