congatec 熱量管理

熱量管理的類型

變更類別視圖
結果: 244
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS
congatec CPU和晶片散熱器 Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2庫存量
最少: 1
倍數: 1
JUMPtec 散熱器 HSP COMe-mBT10 through 6庫存量
最少: 1
倍數: 1
congatec 散熱器 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. 18庫存量
最少: 1
倍數: 1
congatec 散熱器 * Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded 4庫存量
最少: 1
倍數: 1

congatec CPU和晶片散熱器 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3庫存量
最少: 1
倍數: 1
congatec SMX8-Plus/HSP-B
congatec 散熱器 Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. 3庫存量
1在途量
最少: 1
倍數: 1

congatec TCV2/HSP-HP-B
congatec 散熱器 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. 2庫存量
最少: 1
倍數: 1
congatec HPC/cALP-CSA-HP-B
congatec CPU和晶片散熱器 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1庫存量
最少: 1
倍數: 1
congatec conga-TCR8/CSA-HP-B
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. 1庫存量
最少: 1
倍數: 1

JUMPtec 34014-0000-99-3
JUMPtec 散熱器 HSP COMe-mRP10 Cu-core slim through 3庫存量
5在途量
最少: 1
倍數: 1

congatec conga-HPC/mRLP-CSP-B
congatec CPU和晶片散熱器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
最少: 1
倍數: 1

congatec conga-HPC/mRLP-HSP-B
congatec 散熱器 Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 COMe Active Uni Cooler2 (w/o HSP) 53庫存量
最少: 1
倍數: 1

congatec 散熱器 * Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole 179庫存量
最少: 1
倍數: 1
JUMPtec 51099-0000-99-1
JUMPtec CPU和晶片散熱器 SMARC Passive Uni Cooler (w/o HSP) 105庫存量
最少: 1
倍數: 1
JUMPtec 散熱器 HSP COMe-mAL10 E2 thread
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSK COMe-Basic active (w/o HSP)
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-cAP6 Cu-core threaded
最少: 1
倍數: 1

JUMPtec 34006-0000-99-2
JUMPtec 散熱器 HSP COMe-mBT10 slim thread
最少: 1
倍數: 1

congatec conga-HPC/mRLP-CSA-B
congatec CPU和晶片散熱器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
最少: 1
倍數: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU和晶片散熱器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
最少: 1
倍數: 1

congatec 散熱器 * Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded 無庫存前置作業時間 10 週
最少: 1
倍數: 1

congatec 散熱器 * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded. 無庫存前置作業時間 2 週
最少: 1
倍數: 1

congatec 散熱器 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. 無庫存前置作業時間 12 週
最少: 1
倍數: 1
congatec 散熱器 Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. 無庫存前置作業時間 8 週
最少: 1
倍數: 1