GP3000S30-0.060-02-0816

Name: Bergquist Company GP3000S30-0.060-02-0816
Brand: Bergquist Company
SKU: 951-GP3000S30-06002
Price: 5198.54 TWD
Availability: InStock

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請參閱產品規格

Mouser 編號：

951-GP3000S30-06002

製造商編號：

GP3000S30-0.060-02-0816

製造商：

Bergquist Company

說明：

熱介面產品 GAP PAD, Conductive, Soft, 8"x16" Sheet, 0.060" Thickness, TGP3000/3000S30

規格書:

GP3000S30-0.060-02-0816 規格書 (PDF)

ECAD模型:

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庫存量: 97

庫存：: 97

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在途量:: 100
工廠前置作業時間：: 5

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

此產品免費航運

Pricing (TWD)

數量	單價	總價
	NT$5,198.54	NT$5,198.54
	NT$4,671.09	NT$46,710.90
	NT$4,380.60	NT$109,515.00
	NT$4,223.15	NT$211,157.50
	NT$4,221.97	NT$422,197.00
250	報價

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商品屬性	屬性值	選擇屬性
製造商:	Bergquist Company
產品類型:	熱介面產品
RoHS:
產品:	Gap Fillers / Gap Pads / Sheets
類型:	Thermal Pad
封裝/外殼:	Non-standard
材料:	Silicone Elastomer
熱導率:	3 W/m-K
擊穿電壓:	3 kVAC
色彩:	Light Blue
最低工作溫度:	- 60 C
最高工作溫度:	+ 200 C
長度:	406.4 mm
寬度:	203.2 mm
厚度:	1.524 mm
抗張強度:	26 psi
易燃性等級:	UL 94 V-0
系列:	3000S30 / TGP 3000
品牌:	Bergquist Company
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
設計目的:	Processors, Server S-RAMs, Mass Storage Drives, Wireline/Wireless Hardware, Notebooks, BGA, Power Conversion
產品類型:	Thermal Interface Products
大小:	8 in x 16 in
原廠包裝數量:	1
子類別:	Thermal Management
公司名稱:	GAP PAD
零件號別名:	L8INW16INH0.06 BG417321 L8INW16INH0D0 2166354
每件重量:	417 g

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CNHTS:: 3824999999
CAHTS:: 8541900000
USHTS:: 3919905060
JPHTS:: 8542900006
KRHTS:: 3919900000
TARIC:: 8541900000
MXHTS:: 3919909900
ECCN:: EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

TGP 3000 3W/m-K, Reinforced Soft S-Class GAP PAD®

Bergquist TGP 3000 3W/m-K, Reinforced Soft S-Class GAP PAD® features a thermal conductivity of 3W/m-K, providing exceptional thermal performance at low pressures. The material is supplied with protective liners on both sides, which have naturally inherent tack. TGP 3000 GAP PAD from Bergquist is ideal for high-performance, low-stress applications that would typically use fixed standoff or clip mounting. The conformable, yet elastic material offers excellent interfacing and wet-out characteristics.